Semiconductor

| Wafer Bonder

Fully automated Wafer Bonder

-Optimized equipment for mass production
-Extended Cluster Type of Process Module for improving production capacity
-Wafer bonding equipment for heterogeneous / homogeneous materials
-Technology that enables high performance by Wafer integration

HBS-800A Series

PDF Download

Machine Type

Full-Automation

Wafer Size

8inch(Option: 12inch)

Wafer Type

Si, Sapphire, GaAs, GaN and so on.

Bonding method

Eutectic, Adhesive, Epoxy, Polymer

Main module

EFEM, Transfer, Stacker, Pre Aligner, Fine Aligner, Process module

Process Module docking

Max. 4 PM Extensible

Wafer Loading to PM Qty

1 Wafer/PM Loading

Application

Micro LED, Mini LED, FBAR Filter, SAW Filter, CMOS Image Sensor, MEMS, Semiconductor, Acceleration Sensor, Vertical LED

HBS-400A Series

PDF Download

Machine Type

Full-Automation

Wafer Size

4inch(Option: 6.2inch)

Wafer Type

Si, Sapphire, GaAs, GaN and so on.

Bonding method

Eutectic, Adhesive, Epoxy, Polymer

Main module

EFEM, Transfer, Stacker, Pre Aligner, Fine Aligner, Process module

Process Module docking

Max. 3 PM Extensible

Wafer Loading to PM Qty

3 Wafers/PM Loading

Application

Micro LED, Mini LED, FBAR Filter, SAW Filter, CMOS Image Sensor, MEMS, Semiconductor, Acceleration Sensor, Vertical LED

Semi Automated Wafer Bonder

-Optimized equipment for semi production (Variety of materials are available)
-Extended process module for improving production capacity
-Wafer bonding equipment for heterogeneous / homogeneous materials
-Technology that enables high performance by Wafer integration

HBS-800S Series

PDF Download

Machine Type

Semi-Automation

Wafer Size

Up to 8 inch

Wafer Type

Si, Sapphire, GaAs, GaN and so on.

Bonding method

Eutectic, Adhesive, Epoxy, Polymer

Main module

EFEM, Transfer, Stacker, Pre Aligner, Fine Aligner, Process module

Process Module docking

Max. 2 PM Extensible

Wafer Loading to PM Qty

1 Wafer/PM Loading

Application

Micro LED, Mini LED, FBAR Filter, SAW Filter, CMOS Image Sensor, MEMS, Semiconductor, Acceleration Sensor, Vertical LED

Manual Wafer Bonder

-Manual equipment for laboratory (Variety of materials are available)
-Wafer bonding equipment for heterogeneous / homogeneous materials
-Technology that enables high performance by Wafer integration

HBS-600M Series

Coming soon.

Machine Type

Manual

Wafer Size

Up to 6 inch (Option applicable for 8 inch)

Wafer Type

Si, Sapphire, GaAs, GaN and so on.

Bonding method

Eutectic, Adhesive, Epoxy, Polymer

Main module

EFEM, Transfer, Stacker, Pre Aligner, Fine Aligner, Process module

Wafer Loading to PM Qty

1 Wafer/PM Loading

Application

Micro LED, Mini LED, FBAR Filter, SAW Filter, CMOS Image Sensor, MEMS, Semiconductor, Acceleration Sensor, Vertical LED

| Foundry Service

WLP(Wafer Level Package) Process Service

Wafer level bonding process service applied to semiconductor / display manufacturing

Process specification

Wafer Size : Piece ~ 8inch
Type of Wafer : Si, Sapphire, Glass, GaN, GaAs, Etc.
Bonding Method : Eutectic, Adhesive, Epoxy, Polymer
Heating Temp. : Up to 400℃(752℉)
Pressure : 10 ~ 20,000kgf
Align Type : Inner Side Align(ISA with Real Time Align)

Application

-MicroLED, MiniLED, FBAR filter, SAW filter, CIS, Vertical LED, Acceleration sensor, Piezoelectric, Solar cell, etc.

Application

Foundry process

Process Flow

Equipment List for Foundry Service

Equipment List

| Machine Care Service

· Maintenance / Repair / Modify / Heater Flatness / Leveling of Wafer Bonder

· Optimal Driving Recipe / Process Recipe Derivation Service

· Custom Manufacturing Service (Heater / Bonding Jig / Special bonding Jig / Etc.)

· Motorized Press Unit Manufacturing & Dry Pump Overhaul

| History

History

2019

Vibration & Acoustic Transducer Bonding Foundry service

uLED Bonding Foundry service

Micro-LED technical development (special Jig)

Apply for a patent (Substrates bonding device / No. 10-2019-0078978)

2018

Solar cell Bonding Foundry service

Acquired patent for the substrate bonding method to using substrate Pre-bonding device (No. 10-1858665-00-00)

Acquired patent for the Silicon Substrate direct bonding method and Silicon substrate direct bonding device of align parts verification method (No. 10-1854880-00-00)

FBAR Filter Bonding Foundry service

2017

Acceleration sensor Bonding Foundry service

SAW Filter Bonding Foundry service

Started foundry service for wafer bonding process service.

2016

Successful development of “12”W2W Direct bonding system using Wafer surface hydrophilic plasma activation“ by government agency project

Acquired patent for the device for manufacturing replica stamp and method for manufacturing replica stamp (No. 10-1624635-00-00)

2015

Acquired patent for the Imprint device using fluid pressure, Imprint method (No. 10-1501263-00-00)

Acquired patent for the Substrates bonding device using fluid pressure and Substrates bonding method (No. 10-1515180-00-00)

Acquired patent for the Wafer Bonder with holder and wafer bonding method(No. 10-1515181-00-00)

Acquired patent for the Wafer bonder, Wafer bonding device and bonding method using plasma activation process (No. 10-1521971-00-00)

2014

Successful development of “8 inch large area SCIL(Substrate Conformal Imprint Lithography) stamp production facilities and process methods including master and replica stamp surface treatment devices“ by government agency project

Delivered mass production type of Wafer Bonder to S company(8 Inch)

Delivered Wafer Bonder for laboratory to S Research Center(4 Inch)

Delivered Manual Wafer Bonder for laboratory to Y Research Center (6 Inch)

2013

Acquired patent for the Wafer Bonder using electromagnetic wave heating (No.10-1331590-00-00)

Acquired patent for the Wafer Bonder using dual-cooling and Wafer bonding method (10-1320064-00-00)

2012

Successful development of “Wafer bonder for vertical LEDs applied to large area Substrates .” by government agency project

Acquired patent for the device for correction position of Wafer, Wafer bonder and Jig for Wafer bonder (No. 10-1133660-00-00)

Delivered mass production type of Wafer Bonder to N company(8 Inch)

2009

Delivered mass production type of Wafer Bonder to K company(4 Inch)

Delivered Wafer Bonder for laboratory to S Research Center(8 Inch)

Delivered mass production type of Full Auto Wafer Bonder to S company(4 Inch)

Acquired patent for the Wafer bonder and Imprint device (No. 10-0933985-00-00)

2007

Acquired patent for the Transparent sheet heater and method for manufacturing (No. 10-0861787-00-00)

Developed mass production type Wafer Bonder to S company

| References

Company

Institution

| Brochure

Brochure