• 제품소개
    PRODUCT
  •   02.855.2277
  •   hy-ko@hutem.co.kr
    반도체
  • HOME  >  제품소개  >  반도체
  • ■ Nano imprint System
HIS-800U
Nano Imprint & Contact Print System
( Model : HIS-800U )
  • ● Application
  • - Nano electronic device
    - Nano data storage
    - Next generation display
    - Bio device
    - Optical device
  • ■ WAFER BONDING SYSTEM
HBS-MWB-8000
HBS-MWB-8000 / FULL AUTO
  • ● FEATURE
  • WAFER SIZE 8 Inch (OPTION 6, 4, 2 Inch)
    WAFER Si, Sapphire, GaAs, and so on.
    BONDING METHOD Eutectic, Thermo Compressive Standard
    TYPE Full Automation
HBS-MWB-4000
HBS-MWB-4000 / FULL AUTO
  • ● FEATURE
  • WAFER SIZE 4 Inch
    WAFER Si, Sapphire, GaAs, and so on.
    WAFER LOADING 3 WAFER LOADING / 1 JIG
    BONDING METHOD Eutectic, Thermo Compressive Standard
    TYPE Full Automation